Our lines of business are the provision of technical support for the development of electronic products and systems, the complete engineering of the product through the definition of the production process, the creation of masters for printed circuits and the generation of technical documentation necessary for production.

The design process starts from the customer, who is followed and supported in the mastering and engineering phases of the product, allowing to obtain high quality results and cost containment.

The consultancy provided in the choice of strategic components is also very valuable at this stage. GIBIESSE also offers customer support for the development and design of Hardware and Software, using a team of highly experienced external consultants.

GIBIESSE has a complete THT and SMT assembly line with highly qualified personnel, some of whom are also trained with IPC courses and related certification (SPECIALIST or TRAINER, based on the level of training) recognized worldwide within our reference sector. Production is carried out entirely in the Inzago plant, which stands out for its large serial production capacity. This allows us to follow the processes step by step and guarantee high quality standards.

The Inzago plant’s extremely high-standard quality processes allow for the replication of processes so that quality standards are always guaranteed. Each phase of production is monitored to ensure that the finished products always meet the most demanding requirements.

We optimize and finalize the product by offering numerous services such as:

• resin coating – painting
• conformal coating service for the tropicalization of the cards
• production of electromechanical assemblies
• design, engineering and production service of electronic card layouts in order to make them more producible
• assembly, control and testing for cabinets, racks, panels and consoles and wiring
• washing of cards with a robotic ultrasonic system

We also guarantee a complete traceability service, both for the product and the process. For any card, it is possible to know which machines it was produced with and with which transport document each individual component was purchased.

• Optical inspection of components after assembly and soldering with latest-generation 2D and 3D AOI inspection machines and an X-ray machine capable of tomography of a board for the inspection of components without visible pins, such as BGA
• X-RAY for BGA
• Parametric tests with flying probes and custom bed-of-nails
• Functional tests with equipment developed specifically with the customer
• Testing of electronic boards, both functional and parametric, using dedicated test benches or a latest-generation testing machine.