Our business lines are the provision of technical support for the development of electronic products and systems, the complete engineering of the product through the definition of the production process, the creation of masters for printed circuits and the creation of the technical documentation necessary for production.

The design process starts from the customer, who is followed and supported in the mastering and engineering phases of the product, with high quality results and cost avoidance.

The consultancy provided in the choice of strategic components is also very important, at this stage. GIBIESSE also offers support to the customer for the development and design of Hardware and Software, taking advantage of a team of long experienced external consultants.

GIBIESSE has a complete THT and SMT assembly line with highly qualified personnel.

Some of them are also trained with IPC courses and relative certification (SPECIALIST or TRAINER, based on the training level) recognized worldwide in our product sector. Production is entirely carried out at Inzago plant, which stands out for its large serial production capacity. This allows us to follow the processes step by step and guarantee high quality standards.

The high quality processes at Inzago plant allow the replication of processes so that quality standards are always guaranteed. Each production stage is supervised to ensure that the finished products always meet the most demanding requirements.

We optimize and complete the product by offering many services such as:

• conformal coating service for the tropicalization of the boards
• production of electromechanical assemblies
• design and engineering service in addition with the realization of electronic board layouts to make easier its manufacture
• assembly, control and testing for cabinets, racks, panels, consoles and wiring
• washing of boards with a robotic ultrasonic system

We also guarantee a complete traceability service, both for the product and the process. For any card, it is possible to know which machines it was produced with and with which transport document each individual component was purchased.

• Optical inspection of components after assembly, soldering with latest-generation 2D, 3D and AOI inspection machines and an X-ray machine able to make tomography of a board for the inspection of components without visible pins, such as BGA
• X-RAY for BGA
• Flying probe testings and customized bed-of-nails tests.
• Functional tests executed with equipment specifically developped with the customer
• Functional and parameter testings of electronic boards, using reserved test benches or through last-generation testing machines.